一种用于化学机械抛光的加压装置设计研究

中国机械工程 ›› 2010, Vol. 21 ›› Issue (7): 839-842,864.

一种用于化学机械抛光的加压装置设计研究

王彩玲;康仁科;金洙吉

大连理工大学精密与特种加工教育部重点实验室,大连,116024

出版日期:2010-04-10 发布日期:2010-04-16
基金资助:
国家自然科学基金资助项目(50390061)
National Natural Science Foundation of China（No. 50390061）

Research and Design on a Device to Apply Down-force in Chemical Mechanical Polishing Process

Wang Cailing;Kang Renke;Jin Zhuji

Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology, Dalian,Liaoning, 116024

Online:2010-04-10 Published:2010-04-16
Supported by:
National Natural Science Foundation of China（No. 50390061）

摘要/Abstract

摘要：

low-k材料的使用,使低下压力技术成为化学机械抛光（CMP）设备研发设计必须面临的关键技术之一,为适应该需求, 提出了弹性组合元件加压技术,即通过改变加压元件的变形量来实现压力调整的机械调压技术。对该加压模式的设计要求及加压精度进行了理论分析,并进行了加压精度及压力-变形线性关系的实验验证。实验所得的加压精度与理论分析结果比较接近,加压装置的压力与变形之间基本呈线性关系。加压元件可以实现压力从零开始的低下压力、高精度压力调整。



关键词:

化学机械抛光, 低下压力, 弹性组合元件, 加压元件

Abstract:

With the use of low-k material, low down-force CMP has been a crucial technology for the equipment design. The technology of elastic compound elements was promoted to meet the needs of the low down-force. The assembly of the elastic element applied down-force in mechanical model. And down-force on the wafer was controlled by deformation of the pressure element. Requirements and the accuracy of pressure element were analyzed in theory, and the experimental results tallies basically with it. Also the down-force was in linear to the deformation of it. The pressure element can be regulated from zero in high precision under the low down force.

Key words:

chemical mechanical polishing(CMP), low down-force, assembly of elastic element, pressure element

中图分类号:

TN305
TH122

王彩玲, 康仁科, 金洙吉.

一种用于化学机械抛光的加压装置设计研究

[J]. 中国机械工程, 2010, 21(7): 839-842,864.

WANG Cai-Ling, KANG Ren-Ke, JIN Zhu-Ji.

Research and Design on a Device to Apply Down-force in Chemical Mechanical Polishing Process

[J]. China Mechanical Engineering, 2010, 21(7): 839-842,864.

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http://www.cmemo.org.cn/CN/Y2010/V21/I7/839

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