半导体制造中涂胶工艺的研究进展

摘要/Abstract

摘要：

涂胶工艺过程质量的好坏直接影响到光刻工艺的质量,综述了旋转涂胶法和雾化喷涂法两种涂胶方法的工艺特点和研究进展,另外还对电沉积法、气相沉积法等工艺方法进行了简要介绍。对比了旋涂法、喷涂法和电沉积法等涂胶方法的工艺特点,并对不同涂胶工艺方法的应用场合进行了总结。

关键词:

旋涂, 喷涂, 电沉积, 光刻工艺

Abstract:

The quality of the coating of the photoresist impacts the quality of lithography directly. The spin coating and spray coating method and their development process were presented, as well as the electrodeposition(ED), vapor deposition methods. Advantage and disadvantages of the spin coating, spray coating and ED were outlined, and the applications of the different coating methods were summarized.

Key words: spin coating, spray coating, electro-deposition, photolithography

中图分类号:

TN305

向东1, 何磊明1, 瞿德刚1, 2, 牟鹏1, 段广洪1.

半导体制造中涂胶工艺的研究进展

[J]. 中国机械工程, 2012, 23(3): 354-361.

XIANG Dong-1, HE Lei-Meng-1, JI De-Gang-1, 2, MAO Feng-1, DUAN An-Hong-1.

Development of Coating of Photoresist in Semiconductor Manufacturing

[J]. China Mechanical Engineering, 2012, 23(3): 354-361.

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链接本文: http://www.cmemo.org.cn/CN/

http://www.cmemo.org.cn/CN/Y2012/V23/I3/354

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