关键词: 化学机械磨削, 硬脆材料, 磨削机理, 专用磨具

Abstract: At present, the CMG technology was widely applied in fields of optics and semiconductors manufacturing, because it might achieve ultra-precision, high quality and low damage processing for hard-brittle materials such as monocrystalline silicon and quartz glass through chemo-mechanical synergistic processes. Current CMG research status around material removal mechanism, grinding processes and compound processes was reviewed, and these existing problems for related researches were summarized. Factors affecting the quality and processing efficiency of CMG were discussed furtherly. The analyses show that revealing the mechanism of CMG from the perspective of solid-solid phase chemical reaction and chemo-mechanical synergistic effect is helpful to innovate feasible methods to improve the processing efficiency of this technology from the perspectives of material removal mechanism, grinding tool structure design and compound processing development. Furthermore, the probable development trend of CMG technology in the direction of diversified processing materials, more complicated structure processing, multi-energy field compound processing, and related intelligent machining databases were forecasted. 

Key words: chemo-mechanical grinding(CMG), hard-brittle material, grinding mechanism, special grinding tool