中国机械工程 ›› 2021, Vol. 32 ›› Issue (18): 2159-2164.DOI: 10.3969/j.issn.1004-132X.2021.18.003

• 机械基础工程 • 上一篇    下一篇

磨料有序排布电镀砂轮的制备及其把持力研究

赫青山1,2;杨天标2;刘天立1;赵延军1;崔仲鸣2   

  1. 1.郑州磨料磨具磨削研究所有限公司超硬材料磨具国家重点实验室,郑州,450001
    2.河南工业大学机电工程学院,郑州,450001
  • 出版日期:2021-09-25 发布日期:2021-10-13
  • 通讯作者: 杨天标(通信作者),男,1994年生,硕士研究生。研究方向为超硬磨料工具技术、高效磨削加工技术。发表论文1篇。E-mail: 2922955863@qq.com。
  • 作者简介:赫青山,男,1983年生,副教授。E-mail: qingshan@haut.edu.cn。
  • 基金资助:
    国家自然科学基金(51775170,51605144);
    河南省教育厅自然科学项目(18A460010);
    湖南省重点实验室开放基金(E21850)

Preparation of Electroplated Grinding Wheels with Abrasive Ordering Configuration and Study on Pullout Strength

HE Qingshan1,2;YANG Tianbiao2;LIU Tianli1;ZHAO Yanjun1;CUI Zhongming2   

  1. 1.State Key Laboratory of Superabrasives,Zhengzhou Research Institute for Abrasive & Grinding,Zhengzhou,450001
    2.School of Mechanical and Electrical Engineering,Henan University of Technology,Zhengzhou,450001
  • Online:2021-09-25 Published:2021-10-13

摘要: 为解决电镀砂轮磨削加工中容屑空间不足的问题,采用点胶微粘接的方法制备了磨料有序排布的电镀砂轮,分析了磨料粘接效果和镀层力学性能。通过SEM分析了磨料/镀层/导电胶的结合界面,并进行了干磨削试验。研究结果表明,直径约为磨料粒径40%的胶点可粘接住磨料,单个胶点上粘接多颗磨料的占比小于6%;双脉冲电镀工艺制备的镀层显微硬度大于500HV,表层残余应力小于100MPa,磨料/镀层/导电胶之间的界面贴合紧密,无明显缺陷;砂轮在磨削时没有出现磨料脱落现象。

关键词: 电镀砂轮, 磨料有序排布, 高效磨削, 磨料把持力

Abstract: To solve the problems of insufficient storage chip spaces in grinding processes for electroplated grinding wheels, a new electroplated grinding wheel with abrasives ordering configuration was developed by the method of dispensing and adhesion for abrasives. Effectiveness of adhesive for abrasives and mechanics properties for coating were analyzed. Bonding interface characteristics among abrasives, coating, and conductive glue were described by SEM. Dry grinding experiments were carried out. Research results show that glue spots whose diameter accounts for about 40% of abrasive diameter may effectively bond abrasives, and keep abrasive overlap rate of single glue spot less than 6%. Micro hardness of the coating prepared by double pulse electroplating processes is higher than 500HV, and residual stress of surface layer is lower than 100MPa, while the bonding interfaces among the abrasives, the coating, and the conductive glue may integrate close with no obvious defects. There is no fall off of abrasives in dry grinding experiments.

Key words: electroplated grinding wheel, abrasive ordering configuration, high efficiency grinding, pullout strength

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