关键词: 微尺度3D打印, 纳米银浆, 纸基电子, 大高宽比

Abstract: A novel method of the electric-field-driven（EFD）jet deposition micro-scale 3D printing for fabricating high resolution circuit on paper-based surface was proposed. The basic principles and process flows of the proposed method were presented. The effects and rules of the main processing parameters（e. g.， the voltage， back pressure， printing speed） on the accuracy and quality of silver wires fabrications were revealed by a serial of experiments. Then， by using optimized parameters and the nano silver paste（75% silver content and 35 Pa·s（at 25 ℃）dynamic viscosity）， the micro/nano-scale structure with high resolution and high aspect ratio was fabricated by multi-layer stacking on three kinds of paper substrates. For example， the line width with 15 layers stacking on RC photo paper may be kept at 10 μm， and the aspect ratio may be increased to 6.33， causing the 94.8% decrease of the resistance. Finally， flexible electromagnetic actuators（FEMAs） and complex conductive patterns were fabricated on different paper substrates to prove the printing ability. The results show that the new method of EFD 3D printing technology combined with high viscosity and low temperature sintering nano silver paste may provide an effective way for high-performance paper-based electronics. 

Key words:  , micro-scale 3D printing, nano-silver paste, paper-based electronic, high aspect ratio