微流控芯片流体动压抛光工艺研究

doi:10.3969/j.issn.1004-132X.2024.03.015

中国机械工程 ›› 2024, Vol. 35 ›› Issue (03): 534-540.DOI: 10.3969/j.issn.1004-132X.2024.03.015

微流控芯片流体动压抛光工艺研究

付振峰;王振忠;王彪

厦门大学航空航天学院，厦门，361005

出版日期:2024-03-25 发布日期:2024-04-23
通讯作者: 王振忠（通信作者），男，1981年生，教授、博士。研究方向为先进光学元件超精密加工与检测、激光增材加工相关技术等。发表论文40余篇，获授权发明专利及软件著作权20余项，出版专著4本。E-mail:wangzhenzhong@xmu.edu.cn。
作者简介:付振峰，男，1995年生，硕士研究生。研究方向为超精密加工。发表论文4篇。

Research on Microfluidic Chip Fluid Dynamic Pressure Polishing Process

FU Zhenfeng;WANG Zhenzhong;WANG Biao

School of Aeronautics and Astronautics,Xiamen University,Xiamen,Fujian,361005

Online:2024-03-25 Published:2024-04-23

摘要/Abstract

摘要： 基于流体动压润滑理论设计了微结构抛光球，理论分析得出微结构在抛光球转动过程中会产生更大的流体动压力；利用Fluent分析了微结构类型、微结构尺寸对抛光产生的动压力的影响，通过MATLAB拟合Fluent的数据得到其产生的抛光力。得到微结构的较优参数后进行微流控芯片的区域抛光，微流控芯片平面区域表面粗糙度从1.330 nm降至0.658 nm，流道表面粗糙度从0.737 nm降至0.379 nm。由此可进一步探索流体动压抛光技术在微流控芯片确定性抛光中的应用。

关键词: 动压润滑理论, Fluent求解, 超精密抛光, 微流控芯片

Abstract: Microstructure polishing ball was designed based on fluid dynamic pressure lubrication theory, through theoretical analysis of the microstructure in the polishing ball rotation processes to generate more fluid dynamic pressure. Fluent was used to analyze the type of microstructure and the effects of microstructure size on the dynamic pressure generated by polishing, the generated polishing force was obtained by fitting Fluents data via MATLAB. After obtaining the better parameters of microstructure, area polishing of the microfluidic chips was performed. The surface roughness of the microfluidic chip plane area is reduced from 1.330 nm to 0.658 nm, and the surface roughness of the microfluidic chip flow channel is reduced from 0.737 nm to 0.379 nm. Thus, the applications of hydrodynamic pressure polishing process to the deterministic polishing of microfluidic chips may be further explored.

Key words: dynamic pressure lubrication theory, Fluent solution, ultra-precision polishing, microfluidic chip

中图分类号:

TG580.692

付振峰, 王振忠, 王彪. 微流控芯片流体动压抛光工艺研究[J]. 中国机械工程, 2024, 35(03): 534-540.

FU Zhenfeng, WANG Zhenzhong, WANG Biao. Research on Microfluidic Chip Fluid Dynamic Pressure Polishing Process[J]. China Mechanical Engineering, 2024, 35(03): 534-540.

导出引用管理器 EndNote|Ris|BibTeX

链接本文: http://www.cmemo.org.cn/CN/10.3969/j.issn.1004-132X.2024.03.015

http://www.cmemo.org.cn/CN/Y2024/V35/I03/534

参考文献

［1］KURITA R, NIWA O. Microfluidic Platforms for DNA Methylation Analysis［J］. Lab on a Chip, 2016, 16(19):3631-3644.
［2］NAHAVANDI S, BARATCHI S, SOFFE R, et al. Microfluidic Platforms for Biomarker Analysis［J］. Lab on a Chip, 2014, 14(9):1496-1514.
［3］李晓龙. 超快激光辅助化学腐蚀高效制备多功能玻璃微流控器件研究［D］. 上海:华东师范大学, 2022.
LI Xiaolong. High-efficiency Fabrication of Multifunctional Glass Microfluidic Devices Using Ultrafast Laser-assisted Chemical Etching［D］.Shanghai:East China Normal University, 2022.
［4］李庆峰. 基于电化学刻蚀的微流控芯片模具制作［D］. 大连:大连理工大学, 2017.
LI Qingfeng. Fabrication of Microfluidic Chip Mold Based on Electrochemical Etching［D］.Dalian:Dalian University of Technology, 2017.
［5］PENG Wenqiang, DENG Xiong, LUO Zhenbing, et al. A Nano-imprint Method Analysis of the Optical Subsurface Quality Processed by Hydrodynamic Effect Polishing［J］. Optik, 2018, 171:71-76.
［6］WEN Donghui, PIAO Zhongyu, ZHANG Taihua. A Hydrodynamic Suspension Polishing Method for Ultrasmooth and Low-damage Surface［J］. Precision Engineering, 2016, 46:278-287.
［7］CAO Zhongchen, LIN Bin, JIANG Xiangmin, et al. Flow Field Analysis of the Thin Fluid Film in Disc Hydrodynamic Polishing［J］. Procedia CIRP, 2018, 77:363-366.
［8］傅远韬, 文东辉, 孔凡志, 等. 线性液动压抛光加工的流场特性研究［J］. 中国机械工程, 2023, 34(11):1306-1314.
FU Yuantao, WEN Donghui, KONG Fanzhi, et al. Research on Characteristics of Flow Fields during LHP Processes［J］. China Mechanical Engineering, 2023, 34(11):1306-1314.
［9］范晋伟, 印健, 潘日. 微流控芯片磁性抛光工艺参数优化［J］. 北京工业大学学报, 2021, 47(3):209-215.
FAN Jinwei, YIN Jian, PAN Ri. Optimization of Magnetic Polishing Process Parameters of Microfluidic Chip［J］. Journal of Beijing University of Technology, 2021, 47(3):209-215.
［10］计时鸣, 何剑敏, 洪滔, 等. 导流式液流悬浮加工流场特性研究［J］. 中国机械工程, 2012, 23(12):1417-1422.
JI Shiming, HE Jianmin, HONG Tao, et al. Study on Flow Field in Hydrodynamic Suspension Machining with Deflector［J］. China Mechanical Engineering, 2012, 23(12):1417-1422.
［11］卡梅伦. 润滑理论基础［M］. 汪一麟，沈继飞，译.北京:机械工业出版社, 1980.
CAMERON A. Basic Lubrication Theory［M］. WANG Yiling, SHEN Jifei, tran. Beijing:China Machine Press, 1980.
［12］ANDERSON J D. 计算流体力学入门:英文本［M］. 北京:清华大学出版社, 2002.
ANDERSON J D. Computational Fluid Dynamics［M］. Beijing:Tsinghua University Press, 2002.
［13］薛凯元. 线性液动压抛光加工流体动压特性研究［D］. 杭州:浙江工业大学, 2019.
XUE Kaiyuan. Study on Hydrodynamic Characteristics of Linear Hydrodynamic Polishing Process［D］.Hangzhou:Zhejiang University of Technology, 2019.
［14］MOHAMMED M I, ZAINAL ALAM M N H, KOUZANI A, et al. Fabrication of Microfluidic Devices:Improvement of Surface Quality of CO2 Laser Machined Poly(Methylmethacrylate) Polymer［J］. Journal of Micromechanics and Microengineering, 2017, 27(1):015021.
［15］ARCOT Y, SAMUEL G L, KONG Lingxue. Manufacturability and Surface Characterisation of Polymeric Microfluidic Devices for Biomedical Applications［J］. The International Journal of Advanced Manufacturing Technology, 2022, 121(5):3093-3110.
［16］WANG Tong, WU Jian, CHEN Tao, et al. Surface Roughness Analysis and Thermal Bonding of Microfluidic Chips Fabricated by CD/DVD Manufacturing Technology［J］. Microsystem Technologies, 2017, 23(5):1405-1409.
［17］周兵高, 郭钟宁, 于兆勤, 等. 基于玻璃基材的微流控芯片制造工艺［J］. 机电工程技术, 2017, 46(2):49-57.
ZHOU Binggao, GUO Zhongning, YU Zhaoqin, et al. Based on the Microfluidic Chip Manufacturing Technology of Glass Substrate［J］. Mechanical & Electrical Engineering Technology, 2017, 46(2):49-57.

[1]	张宗波, 吴宝贵, 贺庆强, 罗怡, 王晓东, 王立鼎. 带有凸凹微结构的微流控基片热压成形特性研究[J]. 中国机械工程, 2014, 25(16): 2231-2234,2239.
[2]	罗怡, 王晓东, 王立鼎, . 聚合物微流控芯片的键合技术与方法[J]. 中国机械工程, 2008, 19(24): 3012-3018.
[3]	叶嘉明, 李明佳, 周勇亮. 热压法快速制作微流控芯片模具[J]. 中国机械工程, 2007, 18(19): 2379-2382.

微流控芯片流体动压抛光工艺研究

Research on Microfluidic Chip Fluid Dynamic Pressure Polishing Process

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 3

编辑推荐

Metrics