[1]Zhao X Z,Bhushan B. Material Removal Mecha-nisms of Single--crystal Silicon on Nanoscale and at Ultralow Loads[J].Wear,1998,(1/2):66-78.
[2]Yan Y D,Sun T,Dong S. Top--down Nano-mechanical Machining of Three-dimensional Nanostructures by Atomic Force Microscopy[J].Small,2010,(06):724-728.
[3]陈日曜.金属切削原理[M]北京:机械工业出版社,1993.
[4]Belak J,Lucca D A,Komanduri R. Molecular Dynamics Simulation of the Chip Formation Process in Single Crystal Copper and Comparison with Experimental Data[A].New York,1991.100-109.
[5]Fang T H,Weng C I. Molecular Dynamics Simula-tions of Nano--lithography Process Using Atomic Force Microscopy[J].Surface Science,2002,(1/2):138-147.
[6]Fang F Z,Wu H,Liu Y C. Modelling and Experi-mental Investigation on Nanometric Cutting of Monocrystalline Silicon[J].International Journal of Machine Tools and Manufacture,2005,(15):1681-1686.
[7]Mulliah D,Kenny S D,Smith R. Molecular Dynamic Simulations of Nanoscratching of Silver(100)[J].Nanotechnology,2004,(03):243-249.doi:10.1088/0957-4484/15/3/001.
[8]罗熙淳,梁迎春.单晶铝纳米切削过程分子动力学模拟技术研究[J].中国机械工程,2000,11(8):860-862.
[9]郭晓光[1],郭东明[1],康仁科[1],金洙吉[1].单晶硅纳米级磨削过程的理论研究[J].中国机械工程,2008,19(23):2847-2851.
[10]Jin M,Minor A M,Stach E A. Direct Obser-vation of Deformation--induced Grain Growth dur-ing the Nanoindentation of Ultrafine--grained A1 at Room Temperature[J].Acta Materialia,2004,(18):5381-5387.doi:10.1016/j.actamat.2004.07.044.
[11]Mishin Y,Mehl M J,Papaconstantopoulos D A. Structural Stability and Lattice Defects in Cop-per:Ab Initio,Tight--binding,and Embedded--Atom Calculations[J].Physical Review B,2001,(22):224106.
[12]Zhu P Z,Hu Y Z,Ma T B. Study of AFM--based Nanometric Cutting Process Using Molecu-lar Dynamics[J].Applied Surface Science,2010,(13):7160-7165.
[13]Ziegenhain G,Hartmaier A,Urbassek H M. Pair vs Many--body Potentials:Influence on Elastic and Plastic Behavior in Nanoindentation of FCC Metals[J].Journal of the Mechanics and Physics of Sol-ids,2009,(09):1514-1526.
[14]Tschopp M A,McDowell D L. Structures and En-ergies of 3 Asymmetric Tilt Grain Boundaries in Copper and Aluminium[J].Philosophical Magazine,2007,(22):3147-3173.
[15]Lu L,Sui M L,Lu K. Superplastic Extensibility of Nanocrystalline Copper at Room Temperature[J].Science,2000,(5457):1463-1466.
[16]Du D S,Hwang F. Computing in Euclidean Geometry[M].Singapore:World Scientific Publishing Co.Ptc.Ltd,1995.
[17]Matteoli E,Mansoori G A. A Simple Expression for Radial Distribution Functions of Pure Fluids and Mixtures[J].Journal of Chemical Physics,1995,(11):4672-4677.doi:10.1063/1.470654.
[18]Kelchner C L,Plimpton S J,Hamilton J C. Dislocation Nucleation and Defect Structure during Sur-face Indentation[J].Physical Review B,1998.11085-11088.
[19]Honeycutt J D,Andersen H C. Molecular Dynam-ics Study of Melting and Freezing of Small Lennard--jones Clusters[J].Journal of Physical Chemistry,1987,(19):4950-4963.
[20]Zimmerman J A,Kelchner C L,Klein P A. Surface Step Effects on Nanoindentation[J].Physi-cal Review Letters,2001,(16):165507.
[21]Aekland G J,Jones A P. Applications of Local Crystal Structure Measures in Experiment and Simulation[J].Physical Review B,2006.054104.
[22]Tsuzuki H,Branicio P S,Rino J P. Structural Char-acterization of Deformed Crystals by Analysis of Common Atomic Neighborhood[J].Computer Physics Communications,2007,(06):518-523.doi:10.1016/j.cpc.2007.05.018. |