[1]CLARK W I, SHIH A J, LEMASTER R L, et al. Fixed Abrasive Diamond Wire Machining—Part Ⅱ: Experiment Design and Results[J]. International Journal of Machine Tools and Manufacture, 2003, 43(5):533-542.
[2]CHUNG C. Modeling and Experimental Study of Wafer Manufacturing and Machining Processes[D]. New York: Stony Brook University, 2010.
[3]王强国. KDP晶体精密切割与磨削工艺的研究[D]. 大连: 大连理工大学, 2010.
WANG Qiangguo. Study on Precision Slicing and Grinding Processes of KDP Crystal[D]. Dalian: Dalian University of Technology, 2010.
[4]王金生. 亚固结磨料线锯切割机理与实验研究[D]. 杭州: 浙江工业大学, 2012.
WANG Jinsheng. Sawing Mechanism and Experimental Research for Semi-fixed Abrasive Wire Saw[D]. Hangzhou: Zhejiang University of Technology, 2012.
[5]BAO G, WANG W, ZHANG L. Mechanism of Material Removal in Abrasive Electrochemical Multi-wire Sawing of Multi-crystalline Silicon Ingots into Wafers[J]. The International Journal of Advanced Manufacturing Technology, 2017, 91(1/4):383-388.
[6]郑生龙. 多线摇摆往复式线锯切割蓝宝石表面质量的试验研究[D]. 厦门: 华侨大学, 2016.
ZHENG Shenglong. Experimental Research on Sapphire Surface Quality Sliced by Multi-wire Rocking Sawing with Reciprocating Motion of Diamond Wires[D]. Xiamen: Huaqiao University, 2016.
[7]QIU T, YAO C, ZHANG W, et al. Experimental Study of the Cutting Performance of Free-abrasive Wire Sawing in a Magnetic Field[J]. The International Journal of Advanced Manufacturing Technology, 2016, 87(9/12):3113-3122.
[8]WU H. Wire Sawing Technology: a State-of-the-art Review[J]. Precision Engineering, 2016, 43: 1-9.
[9]高玉飞. 电镀金刚石线锯切割单晶硅技术及机理研究[D]. 济南: 山东大学, 2009.
GAO Yufei. Study on Electroplated Diamond Wire Saw Slicing Single Crystal Silicon Technology and Mechanism[D]. Jinan: Shandong University, 2009.
[10]赵礼刚. 金刚石线锯切割半导体陶瓷的机理与工艺研究[D]. 南京: 南京航空航天大学, 2010.
ZHAO Ligang. Research on Slicing Mechanism and Technology with Fixed Diamond Wire Saw for Semiconductor Ceramics[D]. Nangjing: Nangjing University of Aeronautics and Astronautics, 2010.
[11]HUANG H, ZHANG Y, XU X. Experimental Investigation on the Machining Characteristics of Single-crystal SiC Sawing with the Fixed Diamond Wire[J]. The International Journal of Advanced Manufacturing Technology, 2015, 81(5/8):955-965.
[12]ZHU L, KAO I. Galerkin-based Modal Analysis on the Vibration of Wire-slurry System in Wafer Slicing Using a Wiresaw[J]. Journal of Sound and Vibration, 2005, 283(3/5):589-620.
[13]BHAGAVAT S, KAO I. A Finite Element Analysis of Temperature Variation in Silicon Wafers during Wiresaw Slicing[J]. International Journal of Machine Tools and Manufacture, 2008, 48(1):95-106.
[14]张梦骏,孙玉利,左敦稳,等. 金刚石线锯切割技术研究进展[J]. 金刚石与磨料磨具工程, 2013, 33(6):44-48.
ZHANG Mengjun, SUN Yuli, ZUO Dunwen, et al. Development of the Diamond Wire Saw Cutting Technology[J]. Diamond & Abrasives Engineering, 2013, 33(6):44-48.
[15]WATANABE N, KONDO Y, IDE D, et al. Characterization of Polycrystalline Silicon Wafers for Solar Cells Sliced with Novel Fixed-abrasive Wire[J]. Progress in Photovoltaics: Research and Applications. 2010, 18(7):485-490.
[16]GUPTA A, CHEN C A, HSU H. Study on Diamond Wire Wear, Surface Quality, and Subsurface Damage during Multi-wire Slicing of C-plane Sapphire Wafer[J]. The International Journal of Advanced Manufacturing Technology, 2019,100: 1801-1814.
[17]MALKIN S, GUO C. Grinding Technology: theory and Applications of Machining with Abrasives[J]. International Journal of Machine Tools & Manufacture, 1991, 31(3):435-436.
[18]林志树,黄辉,郑生龙. 多线往复式线锯切割中单位长度材料去除量的理论分析与试验研究[J]. 机械工程学报, 2018, 54(13):208-214.
LIN Zhishu, HUANG Hui, ZHENG Shenglong.Theoretical Analysis and Experimental Study on Material Removal Per unit length of Wire in the Cutting of Multi-wire Saw with Reciprocating[J]. Journal of Mechanical Engineering, 2018, 54(13):208-214.
[19]林志树. 多线往复摇摆线锯运动对脆性材料切片质量的影响研究[D]. 厦门: 华侨大学, 2019.
LIN Zhishu. Study on Sawn Quality of Brittle Material Influenced by Motions in Multi-wire Saw with Reciprocating and Rocking[D]. Xiamen: Huaqiao University, 2019.
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