Inversion Analysis of Surface Micro-geomorphology in Splicing Areas of Cover Molds

doi:10.3969/j.issn.1004-132X.2021.07.007

Abstract

Abstract: In order to improve processing quality of splicing areas for body cover panel die, the geometric characteristics of surface appearance and spatial characteristics of residual height before and after splicing seams were analyzed separately under different processing parameters. And then, energy entropy of different frequency bands for contour signals of the processing surfaces was extracted based on wavelet packets characteristics. Finally, processing parameters of the surface topography were retrieved according to the energy entropy characteristics, material removal rate, and tool life prediction function. Research results show that the processing parameters obtained based on inversion analysis method may achieve controllable micro-geometry of the splicing areas.

Key words: splicing mould, surface topography, wavelet packet, energy entropy, inversion analysis

摘要： 为提高车身覆盖件模具拼接区的加工质量，首先分析不同加工参数下拼接缝前后的表面形貌几何特性和残留高度的空间特性，然后基于小波包提取加工表面轮廓信号不同频段的能量熵特征，最后根据能量熵特征、材料去除率和刀具寿命预测函数反演表面形貌的加工参数。研究结果表明，基于反演分析方法得到的加工参数可以实现拼接区微观几何形貌的可控。

关键词: 拼接模具, 表面形貌, 小波包, 能量熵, 反演分析

CLC Number:

TH164

WU Shi, ZHAO Hongwei, LI Xin. Inversion Analysis of Surface Micro-geomorphology in Splicing Areas of Cover Molds[J]. China Mechanical Engineering, 2021, 32(07): 806-804.

吴石, 赵洪伟, 李鑫. 覆盖件模具拼接区表面微观几何形貌的反演分析[J]. 中国机械工程, 2021, 32(07): 806-804.

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