Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets

doi:10.3969/j.issn.1004-132X.2021.19.012

Abstract

Abstract: In order to realize the repair of microelectronics circuits in aviation equipment quickly and accurately， a direct printing method was proposed for preparing uniform tin solder bump arrays with multiple bump sizes. Influence factors of the landing accuracy of printed bumps and the high consistency quality were analyzed. Tin solder bump array was direct printed by utilizing a proprietary 3D printing equipment. The testing results show that solder bump arrays are printed with the height standard deviation less than 6 μm and the landing errors less than ±5 μm， respectively. Solder columns stacked by multiple droplets are remelted and reshaped into uniform solder bump arrays with different sizes by the heating and remelting method. After remelting， the height consistency of remelting bumps is improved remarkably， but the number of stacked droplets should be limited. The testing results provide a novel method for rapidly repairing small batch packages and damaged expensive chips in avionics.

Key words: bump array, accurate repair, uniform tin solder ball, 3D printing, heating and remelting

摘要： 为实现航空装备微电子电路的快速、精准修复，提出了多尺寸均匀锡焊料凸点阵列直接打印的方法，分析了打印凸点的位置精度和高度一致性等质量影响因素。利用开发的均匀锡焊微滴3D打印设备开展了多尺寸锡焊料凸点阵列均匀微滴直接打印试验，试验结果表明，所开发的设备可获得高度标准差不超过6 μm、位置误差不超过±5 μm的焊料凸点阵列；采用加热重熔方法可将多颗焊滴堆栈立柱整形为单颗多尺寸规格的焊料凸点阵列，重熔凸点的高度一致性得到了显著提高，但应限制堆栈焊粒数量。该试验结果为航空装备昂贵芯片的小批封装和单件损伤快速修复提供了新方法。

关键词: 凹凸阵列, 精准修复, 均匀锡焊球, 3D打印, 加热重熔

CLC Number:

TH166
V461

GAO Kun, LI Yingxiang, QI Lehua, WU Lang, ZHOU Yi, DOU Yibo, LUO Jun. Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets[J]. China Mechanical Engineering, 2021, 32(19): 2367-2373.

高昆, 黎映相, 齐乐华, 吴浪, 周怡, 豆毅博, 罗俊. 参数对均匀微滴打印多尺寸锡焊料凸点阵列的影响[J]. 中国机械工程, 2021, 32(19): 2367-2373.

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