Experimental Research of Surface Quality Evaluation Method for Wire Saw Sapphire Wafer

doi:10.3969/j.issn.1004-132X.2022.17.002

Abstract

Abstract: Multi-wire sawing was widely used in slicing of hard and brittle materials. Surface quality of sliced wafers had a greater impact on the subsequent grinding and polishing processes. A surface quality evaluation indicator of sliced wafers named MMA was proposed for wire sawing. The measurement principle of MMA was designed， and the implementation plan was given in detail. The influences of processing parameters on MMA at different positions of wire net were analyzed. The results show that the MMA proposed herein may better reflect the influences of wire cutting process parameters on the surface quality of wafers.

Key words: , multi wire saw, wafer, surface quality, minimum machining allowance（MMA）

摘要： 多线切割广泛应用于硬脆材料的切片加工，线切后晶片的面形质量会对后续研磨抛光加工工艺产生较大影响。提出了一种针对线切片面形质量的评价指标：线切片最小加工余量（MMA）；设计出MMA的测量原理，并给出具体实施方法；分析了不同工艺参数下线网不同位置处MMA的变化规律。试验结果表明，提出的评价指标能够更好地反映线切加工工艺参数对晶片面形质量的影响规律。

关键词: 多线切割, 晶片, 面形质量, 最小加工余量

CLC Number:

TG 58

WANG Lanqing, HUANG Hui, CUI Changcai. Experimental Research of Surface Quality Evaluation Method for Wire Saw Sapphire Wafer[J]. China Mechanical Engineering, 2022, 33(17): 2023-2028.

王兰青, 黄辉, 崔长彩. 线切蓝宝石晶片面形质量评价方法的试验研究[J]. 中国机械工程, 2022, 33(17): 2023-2028.

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