Abstract: At present, the existing technology still faced great challenges in the mass manufacturing of high resolution and high density circuits at low-cost, which might not meet the requirements of high frequency, high speed and high density integration of ceramic-based circuits. Therefore, a new method was proposed for electric-field-driven jet deposition micro 3D printing of high resolution aluminum nitride ceramic-based circuits in combination with sacrificial coatings. The sacrificial coating was used to overcome the instability of the jet flows caused by the roughnesses of the ceramic surfaces, and the line widths were further reduced by the hydrophobic characteristics of the sacrificial coating, and the fabrication of high-resolution circuits was realized. The effects of printing parameters(voltage, air pressure, printing height, printing speed), sacrifice layer and sintering process on the width and morphology of the printed silver wire were studied by experiments and the processing parameters were optimized. Finally, using a conductive silver paste with 70%(mass fraction) silver content combined with optimized processing parameters, a variety of complex circuit patterns were fabricated on the surface of aluminum nitride substrates, including a high-density, high-resolution circuit pattern with a line width/line spacing of 2/3 and a conductive silver line with a minimum line width of 8.1 μm reported so far. The results show that the new method of electric-field-driven jet deposition microscale 3D printing of aluminum nitride ceramic-based circuits in combination with sacrificial coatings may provide an effective way for the low-cost mass manufacturing of miniaturized and high-power ceramic-based integrated circuits.

Key words: microscale 3D printing, sacrificial coating, aluminum nitride ceramic-based circuit, high resolution

摘要： 现有技术在高分辨率高密度电路的低成本批量化制造上仍然面临巨大挑战，无法满足陶瓷基电路对高频、高速、高密度集成的要求。提出了一种结合牺牲层的电场驱动喷射沉积微3D打印高分辨率氮化铝陶瓷基电路的新方法,该方法利用牺牲层克服了因陶瓷表面粗糙导致的射流不稳定问题，并借助牺牲层表面疏水特性进一步缩小线宽，实现了高分辨率电路的制造。实验研究了打印参数（电压、气压、打印高度、打印速度）、牺牲层以及烧结工艺对打印银线线宽和形貌的影响并优化了工艺参数。最后，使用含银量70%（质量分数）的导电银浆结合优化的工艺参数，在氮化铝基材表面实现了多种复杂电路图案制造，包括线宽/线距为2/3的高密度高分辨率电路图案以及目前已报道的最小线宽为8.1 μm的导电银线。研究结果表明，结合牺牲层的电场驱动喷射沉积微尺度3D打印氮化铝陶瓷基电路新方法可为小型化、高功率陶瓷基集成电路低成本批量化制造提供有效途径。

关键词: 微尺度3D打印, 牺牲层, 氮化铝陶瓷基电路, 高分辨率