A strategy consisting of fixed-abrasive lapping and a developed environment-friendly solution was proposed for polishing cadmium zinc telluride(CdZnTe or CZT). This was to eliminate the disadvantages for conventional machining method including free abrasive lapping, polishing and chemical mechanical polishing on CZT wafers. Waterproof paper of alumina with mesh size of 3000 was employed as fixed-abrasive lapping pad. Lapping experiments were conducted at a pressure of 17kPa on CZT wafers. The rotation speeds for polishing plate and pad were as 80r/min respectively, and the duration was as 5min during lapping experiments. The developed environment-friendly solution consisted of peroxide, silica, and natural orange juice that was used for pH modulator. Chemical mechanical polishing was carried out at a pressure of 28kPa, rotation speeds of 60r/min for both of polishing pad and plate, and a duration of 30min. The experimental results show that ultra-smooth polished surfaces are achieved, where surface roughness Ra, root mean square(rms), and peak-to-valley(PV) values are as 0.568nm, 0.724nm, and 6.061nm, respectively.
